M464S3253J60-C7A
vs
HYM7V75A801BTZG-10S
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
SK HYNIX INC
Part Package Code
MODULE
MODULE
Package Description
DIMM,
DIMM, DIMM144,32
Pin Count
144
144
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.28
8542.32.00.32
Access Mode
DUAL BANK PAGE BURST
FOUR BANK PAGE BURST
Additional Feature
AUTO/SELF REFRESH; SEATED HGT-NOM; WD-MAX
AUTO/SELF REFRESH
JESD-30 Code
R-XDMA-N144
R-XDMA-N144
Length
67.6 mm
Memory Density
536870912 bit
603979776 bit
Memory IC Type
SYNCHRONOUS DRAM MODULE
SYNCHRONOUS DRAM MODULE
Memory Width
8
72
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
144
144
Number of Words
67108864 words
8388608 words
Number of Words Code
64000000
8000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
64MX8
8MX72
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIMM
DIMM
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
31.75 mm
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
DUAL
DUAL
Width
3.8 mm
Base Number Matches
1
1
Access Time-Max
6 ns
Clock Frequency-Max (fCLK)
100 MHz
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
DIMM144,32
Refresh Cycles
4096
Standby Current-Max
0.018 A
Supply Current-Max
1.62 mA
Compare M464S3253J60-C7A with alternatives
Compare HYM7V75A801BTZG-10S with alternatives