M38510R76203BEX
vs
5962F8953901VEC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
STMICROELECTRONICS
Package Description
DIP,
DIP, DIP16,.3
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
AC
AC
JESD-30 Code
R-GDIP-T16
R-GDIP-T16
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
TRUE
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
11.5 ns
11 ns
Qualification Status
Not Qualified
Qualified
Screening Level
MIL-M-38510 Class B
MIL-PRF-38535 Class V
Supply Voltage-Max (Vsup)
5.5 V
6 V
Supply Voltage-Min (Vsup)
3 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
3 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Total Dose
100k Rad(Si) V
300k Rad(Si) V
Base Number Matches
1
1
Pbfree Code
No
Rohs Code
No
Part Package Code
DIP
Pin Count
16
Load Capacitance (CL)
50 pF
Max I(ol)
0.012 A
Moisture Sensitivity Level
1
Output Characteristics
3-STATE
Package Equivalence Code
DIP16,.3
Prop. Delay@Nom-Sup
11 ns
Terminal Pitch
2.54 mm
Compare M38510R76203BEX with alternatives
Compare 5962F8953901VEC with alternatives