M38510H17203BCA
vs
TC4030BP
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
HARRIS SEMICONDUCTOR
TOSHIBA CORP
Part Package Code
DIP
DIP
Package Description
DIP,
DIP, DIP14,.3
Pin Count
14
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-GDIP-T14
R-PDIP-T14
Logic IC Type
XOR GATE
XOR GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
350 ns
280 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535 Class B
Supply Voltage-Max (Vsup)
15 V
18 V
Supply Voltage-Min (Vsup)
4.5 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Total Dose
1M Rad(Si) V
Base Number Matches
2
1
Pbfree Code
Yes
Rohs Code
No
Samacsys Manufacturer
Toshiba
Length
19.25 mm
Load Capacitance (CL)
50 pF
Max I(ol)
0.012 A
Package Equivalence Code
DIP14,.3
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Power Supply Current-Max (ICC)
0.03 mA
Prop. Delay@Nom-Sup
280 ns
Schmitt Trigger
NO
Seated Height-Max
4.45 mm
Terminal Pitch
2.54 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
Compare M38510H17203BCA with alternatives
Compare TC4030BP with alternatives