M38510H05253SCA
vs
HEF4002BP,652
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HARRIS SEMICONDUCTOR
NXP SEMICONDUCTORS
Package Description
DIP,
PLASTIC, DIP-14
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-GDIP-T14
R-PDIP-T14
Logic IC Type
NOR GATE
NOR GATE
Number of Functions
2
2
Number of Inputs
4
4
Number of Terminals
14
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
315 ns
120 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-M-38510 Class S
Supply Voltage-Max (Vsup)
15 V
15 V
Supply Voltage-Min (Vsup)
4.5 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Total Dose
1M Rad(Si) V
Base Number Matches
2
1
Rohs Code
Yes
Part Package Code
DIP
Pin Count
14
Manufacturer Package Code
SOT27-1
Factory Lead Time
4 Weeks
JESD-609 Code
e4
Length
19.025 mm
Load Capacitance (CL)
50 pF
Max I(ol)
0.00035999999999999997 A
Package Equivalence Code
DIP14,.3
Prop. Delay@Nom-Sup
120 ns
Schmitt Trigger
NO
Seated Height-Max
4.2 mm
Terminal Finish
NICKEL PALLADIUM GOLD
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare M38510H05253SCA with alternatives
Compare HEF4002BP,652 with alternatives