M38510H05151BCA vs 933373600005 feature comparison

M38510H05151BCA Harris Semiconductor

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933373600005 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR NXP SEMICONDUCTORS
Package Description DIP, DIE,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T14 X-XUUC-N
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 1 1
Number of Functions 2 2
Number of Terminals 14
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material CERAMIC, GLASS-SEALED UNSPECIFIED
Package Code DIP DIE
Package Shape RECTANGULAR UNSPECIFIED
Package Style IN-LINE UNCASED CHIP
Propagation Delay (tpd) 825 ns 220 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535 Class B
Supply Voltage-Max (Vsup) 15 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 10 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY
Terminal Form THROUGH-HOLE NO LEAD
Terminal Position DUAL UPPER
Total Dose 1M Rad(Si) V
Trigger Type POSITIVE EDGE POSITIVE EDGE
fmax-Min 1 MHz 20 MHz
Base Number Matches 1 1
Part Package Code WAFER
Package Equivalence Code DIE OR CHIP

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