M38510/76302BFA
vs
5962H9655401QXA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
QP SEMICONDUCTOR INC
AEROFLEX MICROELECTRONIC SOLUTIONS
Package Description
DFP,
DFP, FL16,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Count Direction
UP
UP
JESD-30 Code
R-GDFP-F16
R-XDFP-F16
JESD-609 Code
e0
Load/Preset Input
YES
YES
Logic IC Type
BINARY COUNTER
BINARY COUNTER
Mode of Operation
SYNCHRONOUS
SYNCHRONOUS
Number of Bits
4
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC
Package Code
DFP
DFP
Package Equivalence Code
FL16,.3
FL16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
FLATPACK
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
FLAT
FLAT
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
Base Number Matches
3
4
Load Capacitance (CL)
50 pF
Max Frequency@Nom-Sup
77000000 Hz
Max I(ol)
0.008 A
Screening Level
38535Q/M;38534H;883B
Supply Voltage-Nom (Vsup)
5 V
Terminal Pitch
1.27 mm
Total Dose
1M Rad(Si) V
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