M38510/76302BEX
vs
MC74AC161DT
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HARRIS SEMICONDUCTOR
ON SEMICONDUCTOR
Package Description
DIP,
TSSOP, TSSOP16,.25
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Count Direction
UP
UP
Family
AC
AC
JESD-30 Code
R-GDIP-T16
R-PDSO-G16
Load/Preset Input
YES
YES
Logic IC Type
BINARY COUNTER
BINARY COUNTER
Mode of Operation
SYNCHRONOUS
SYNCHRONOUS
Number of Bits
4
4
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)
12 ns
13.5 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
6 V
Supply Voltage-Min (Vsup)
3 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Base Number Matches
1
2
Part Package Code
TSSOP
Pin Count
16
Length
5 mm
Load Capacitance (CL)
50 pF
Max Frequency@Nom-Sup
60000000 Hz
Max I(ol)
0.012 A
Package Equivalence Code
TSSOP16,.25
Seated Height-Max
1.2 mm
Terminal Pitch
0.65 mm
Width
4.4 mm
fmax-Min
95 MHz
Compare M38510/76302BEX with alternatives
Compare MC74AC161DT with alternatives