M38510/75201BCA vs MC74AC32N feature comparison

M38510/75201BCA QP Semiconductor

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MC74AC32N Motorola Mobility LLC

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer QP SEMICONDUCTOR INC MOTOROLA INC
Part Package Code DIP DIP
Package Description CERAMIC, DIP-14 DIP, DIP14,.3
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family AC AC
JESD-30 Code R-GDIP-T14 R-PDIP-T14
JESD-609 Code e0 e0
Logic IC Type OR GATE OR GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 12.5 ns 7.5 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 3 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 6 5
Length 18.86 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.012 A
Package Equivalence Code DIP14,.3
Prop. Delay@Nom-Sup 10 ns
Schmitt Trigger NO
Seated Height-Max 4.69 mm
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare M38510/75201BCA with alternatives

Compare MC74AC32N with alternatives