M38510/65701BCX
vs
MC54HCT04AJD
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Contact Manufacturer
Obsolete
Ihs Manufacturer
SRI INTERNATIONAL
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
DIP
Package Description
DIP,
DIP, DIP14,.3
Pin Count
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Family
HC/UH
HCT
JESD-30 Code
R-XDIP-T14
R-XDIP-T14
Logic IC Type
INVERTER
INVERTER
Number of Functions
6
6
Number of Inputs
1
1
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
UNSPECIFIED
CERAMIC
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
22 ns
26 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535 Class B
Supply Voltage-Max (Vsup)
6 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
2
3
Rohs Code
No
JESD-609 Code
e0
Length
19.495 mm
Load Capacitance (CL)
50 pF
Max I(ol)
0.004 A
Package Equivalence Code
DIP14,.3
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Power Supplies
5 V
Prop. Delay@Nom-Sup
26 ns
Schmitt Trigger
NO
Seated Height-Max
5.08 mm
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Pitch
2.54 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
Compare M38510/65701BCX with alternatives
Compare MC54HCT04AJD with alternatives