M38510/65003BCA
vs
SNJ54LS20J
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Contact Manufacturer
Ihs Manufacturer
MOTOROLA INC
ROCHESTER ELECTRONICS LLC
Package Description
DIP,
CERAMIC, DIP-14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
LS
JESD-30 Code
R-GDIP-T14
R-GDIP-T14
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
2
2
Number of Inputs
4
4
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
26 ns
15 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-M-38510 Class B
MIL-PRF-38535
Supply Voltage-Max (Vsup)
6 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
4.5 V
Supply Voltage-Nom (Vsup)
4.5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
TTL
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
4
2
Pbfree Code
No
Rohs Code
No
Part Package Code
DIP
Pin Count
14
Length
19.56 mm
Max I(ol)
0.004 A
Package Equivalence Code
DIP14,.3
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Power Supply Current-Max (ICC)
2.2 mA
Prop. Delay@Nom-Sup
15 ns
Schmitt Trigger
NO
Seated Height-Max
5.08 mm
Terminal Pitch
2.54 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
Compare M38510/65003BCA with alternatives
Compare SNJ54LS20J with alternatives