M38510/34107BEX vs MC74F174N feature comparison

M38510/34107BEX NXP Semiconductors

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MC74F174N Motorola Mobility LLC

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Package Description DIP, DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family F/FAST F/FAST
JESD-30 Code R-GDIP-T16 R-PDIP-T16
Length 19.3 mm 19.175 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 6 6
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 12 ns 11 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.19 mm 4.44 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.62 mm 7.62 mm
fmax-Min 90 MHz 80 MHz
Base Number Matches 1 2
Part Package Code DIP
Pin Count 16
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Power Supply Current-Max (ICC) 45 mA
Terminal Finish Tin/Lead (Sn/Pb)

Compare M38510/34107BEX with alternatives

Compare MC74F174N with alternatives