M38510/33903BEX vs 74F157ADC feature comparison

M38510/33903BEX NXP Semiconductors

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74F157ADC Texas Instruments

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP DIP
Package Description DIP, DIP, DIP16,.3
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family F/FAST F/FAST
JESD-30 Code R-GDIP-T16 R-GDIP-T16
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Output Characteristics 3-STATE
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 7.5 ns 7 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535 Class B
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Rohs Code No
JESD-609 Code e0
Length 19.43 mm
Max I(ol) 0.02 A
Package Equivalence Code DIP16,.3
Power Supply Current-Max (ICC) 23 mA
Prop. Delay@Nom-Sup 11 ns
Seated Height-Max 5.08 mm
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare M38510/33903BEX with alternatives

Compare 74F157ADC with alternatives