M38510/33801BLA
vs
74F582N
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
QP SEMICONDUCTOR INC
|
PHILIPS COMPONENTS
|
Part Package Code |
DIP
|
|
Package Description |
DIP,
|
,
|
Pin Count |
24
|
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
F/FAST
|
F/FAST
|
JESD-30 Code |
R-GDIP-T24
|
R-PDIP-T24
|
JESD-609 Code |
e0
|
|
Logic IC Type |
ARITHMETIC LOGIC UNIT
|
ARITHMETIC LOGIC UNIT
|
Number of Bits |
4
|
4
|
Number of Functions |
1
|
1
|
Number of Terminals |
24
|
24
|
Operating Temperature-Max |
125 °C
|
70 °C
|
Operating Temperature-Min |
-55 °C
|
|
Output Polarity |
TRUE
|
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Propagation Delay (tpd) |
16 ns
|
16 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
TTL
|
TTL
|
Temperature Grade |
MILITARY
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
3
|
1
|
Additional Feature |
|
BCD ADDER/SUBTRACTOR
|
|
|
|
Compare M38510/33801BLA with alternatives
Compare 74F582N with alternatives