M38510/32502BRA vs GD74LS373J feature comparison

M38510/32502BRA NXP Semiconductors

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GD74LS373J LG Semicon Co Ltd

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS LG SEMICON CO LTD
Part Package Code DIP
Package Description DIP, DIP, DIP20,.3
Pin Count 20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LS
JESD-30 Code R-GDIP-T20 R-XDIP-T20
Logic IC Type BUS DRIVER D LATCH
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2
Number of Terminals 20 20
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 24 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535 Class B
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 8 2
Rohs Code No
JESD-609 Code e0
Load Capacitance (CL) 45 pF
Max I(ol) 0.024 A
Package Equivalence Code DIP20,.3
Power Supply Current-Max (ICC) 40 mA
Prop. Delay@Nom-Sup 30 ns
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm

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