M38510/32502B2A vs 74HCT373D-Q100,118 feature comparison

M38510/32502B2A NXP Semiconductors

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74HCT373D-Q100,118 NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code QLCC SOP
Package Description QCCN, 7.50 MM, PLASTIC, MS-013, SOT163-1, SOP-20
Pin Count 20 20
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01
Family LS HCT
JESD-30 Code S-CQCC-N20 R-PDSO-G20
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code QCCN SOP
Package Equivalence Code LCC20,.35SQ SOP20,.4
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER SMALL OUTLINE
Propagation Delay (tpd) 24 ns 48 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535 Class B AEC-Q100
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology TTL CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form NO LEAD GULL WING
Terminal Position QUAD DUAL
Base Number Matches 6 2
Rohs Code Yes
Manufacturer Package Code SOT163-1
Factory Lead Time 4 Weeks
Length 12.8 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.006 A
Moisture Sensitivity Level 1
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 45 ns
Seated Height-Max 2.65 mm
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 7.5 mm

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