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M38510/31603B2X vs 74HC259DB,118 feature comparison

M38510/31603B2X Lansdale Semiconductor Inc

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74HC259DB,118 NXP Semiconductors

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Part Life Cycle Code Active Transferred
Ihs Manufacturer LANSDALE SEMICONDUCTOR INC NXP SEMICONDUCTORS
Part Package Code QLCC SSOP1
Package Description QCCN, 5.30 MM, PLASTIC, MO-150, SOT-338-1, SSOP-16
Pin Count 20 16
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LS HC/UH
JESD-30 Code S-CQCC-N20 R-PDSO-G16
Logic IC Type D LATCH D LATCH
Number of Bits 8 1
Number of Functions 1 1
Number of Terminals 20 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code QCCN SSOP
Package Equivalence Code LCC20,.35SQ SSOP16,.3
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd) 56 ns 255 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology TTL CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form NO LEAD GULL WING
Terminal Position QUAD DUAL
Trigger Type NEGATIVE EDGE LOW LEVEL
Base Number Matches 7 2
Rohs Code Yes
Manufacturer Package Code SOT338-1
Additional Feature 1:8 DMUX FOLLOWED BY LATCH
JESD-609 Code e4
Length 6.2 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 56 ns
Seated Height-Max 2 mm
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch 0.65 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 5.3 mm
Logic » FF/Latches
Logic » FF/Latches

Compare M38510/31603B2X with alternatives

Compare 74HC259DB,118 with alternatives