M38510/31508BEX vs S54LS193F feature comparison

M38510/31508BEX NXP Semiconductors

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S54LS193F Philips Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS SIGNETICS CORP
Part Package Code DIP
Package Description DIP, ,
Pin Count 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.4 12.4
Average Weight (mg) 1187.4 1187.4
CO2e (mg) 14723.76 14723.76
Category CO2 Kg 12.4 12.4
Compliance Temperature Grade Military: -55C to +125C Military: -55C to +125C
Count Direction BIDIRECTIONAL BIDIRECTIONAL
Family LS LS
JESD-30 Code R-GDIP-T16 R-GDIP-T16
Load/Preset Input YES YES
Logic IC Type BINARY COUNTER BINARY COUNTER
Mode of Operation SYNCHRONOUS SYNCHRONOUS
Number of Bits 4 4
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 63 ns 47 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
fmax-Min 22 MHz 32 MHz
Base Number Matches 11 3
Load Capacitance (CL) 15 pF
Power Supply Current-Max (ICC) 34 mA

Compare M38510/31508BEX with alternatives

Compare S54LS193F with alternatives