M38510/31505BEX
vs
SN74LS168JD
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Contact Manufacturer
Obsolete
Ihs Manufacturer
SRI INTERNATIONAL
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
DIP
Package Description
CERAMIC, DIP-16
DIP, DIP16,.3
Pin Count
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Count Direction
BIDIRECTIONAL
BIDIRECTIONAL
Family
LS
JESD-30 Code
R-GDIP-T16
R-XDIP-T16
Load/Preset Input
YES
YES
Logic IC Type
DECADE COUNTER
DECADE COUNTER
Mode of Operation
SYNCHRONOUS
SYNCHRONOUS
Number of Bits
4
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
26 ns
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
MILITARY
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
fmax-Min
29 MHz
Base Number Matches
1
3
Rohs Code
JESD-609 Code
e0
Output Characteristics
3-STATE
Package Equivalence Code
DIP16,.3
Power Supplies
5 V
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Pitch
2.54 mm
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