M38510/31101BEX vs S54LS85F883B feature comparison

M38510/31101BEX Philips Semiconductors

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S54LS85F883B NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIGNETICS CORP SIGNETICS CORP
Package Description DIP, DIP, DIP16,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LS LS
JESD-30 Code R-GDIP-T16 R-GDIP-T16
Logic IC Type MAGNITUDE COMPARATOR MAGNITUDE COMPARATOR
Number of Bits 4 4
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 42 ns 30 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 10 3
Rohs Code No
Part Package Code DIP
Pin Count 16
Additional Feature CASCADABLE
JESD-609 Code e0
Package Equivalence Code DIP16,.3
Screening Level MIL-STD-883 Class B
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm

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