M38510/30906BEA vs SN74LS257BN feature comparison

M38510/30906BEA Lansdale Semiconductor Inc

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SN74LS257BN Motorola Mobility LLC

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Part Life Cycle Code Active Transferred
Ihs Manufacturer LANSDALE SEMICONDUCTOR INC MOTOROLA INC
Part Package Code DIP DIP
Package Description DIP, DIP16,.3 DIP, DIP16,.3
Pin Count 16 16
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LS LS
JESD-30 Code R-GDIP-T16 R-PDIP-T16
JESD-609 Code e0 e0
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.012 A 0.024 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supply Current-Max (ICC) 19 mA 16 mA
Prop. Delay@Nom-Sup 35 ns 21 ns
Propagation Delay (tpd) 39 ns 21 ns
Qualification Status Qualified Not Qualified
Screening Level MIL-PRF-38535 Class B
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY COMMERCIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 9 6
Length 19.175 mm
Load Capacitance (CL) 45 pF
Seated Height-Max 4.44 mm
Width 7.62 mm

Compare M38510/30906BEA with alternatives

Compare SN74LS257BN with alternatives