M38510/30902BFA
vs
TC74HCT158AF(TP1)
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
QP SEMICONDUCTOR INC
|
TOSHIBA CORP
|
| Part Package Code |
DFP
|
SOIC
|
| Package Description |
DFP,
|
0.300 INCH, PLASTIC, SOP-16
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Family |
LS
|
HCT
|
| JESD-30 Code |
R-GDFP-F16
|
R-PDSO-G16
|
| JESD-609 Code |
e0
|
e0
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Number of Functions |
2
|
4
|
| Number of Inputs |
4
|
2
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Output Polarity |
TRUE
|
INVERTED
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DFP
|
SOP
|
| Package Equivalence Code |
FL16,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
SMALL OUTLINE
|
| Propagation Delay (tpd) |
65 ns
|
50 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
TTL
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
FLAT
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
11
|
1
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| Length |
|
10.3 mm
|
| Load Capacitance (CL) |
|
50 pF
|
| Peak Reflow Temperature (Cel) |
|
240
|
| Seated Height-Max |
|
1.9 mm
|
| Terminal Pitch |
|
1.27 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Width |
|
5.3 mm
|
|
|
|
Compare M38510/30902BFA with alternatives
Compare TC74HCT158AF(TP1) with alternatives