M38510/30801BJX
vs
SN74LS181J
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
QP SEMICONDUCTOR INC
MOTOROLA INC
Part Package Code
DIP
Package Description
DIP,
DIP, DIP24,.6
Pin Count
24
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LS
JESD-30 Code
R-CDIP-T24
R-XDIP-T24
Logic IC Type
ARITHMETIC LOGIC UNIT
ARITHMETIC LOGIC UNIT
Number of Bits
2
Number of Functions
4
Number of Terminals
24
24
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
100 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535 Class B
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
BIPOLAR
TTL
Temperature Grade
MILITARY
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
4
5
Rohs Code
JESD-609 Code
e0
Package Equivalence Code
DIP24,.6
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Pitch
2.54 mm
Compare M38510/30801BJX with alternatives