M38510/30801BJX vs M38510/30801BJA feature comparison

M38510/30801BJX Lansdale Semiconductor Inc

Buy Now

M38510/30801BJA Motorola Mobility LLC

Buy Now
Part Life Cycle Code Active Obsolete
Ihs Manufacturer LANSDALE SEMICONDUCTOR INC MOTOROLA INC
Part Package Code DIP
Package Description DIP, DIP,
Pin Count 24
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LS LS
JESD-30 Code R-CDIP-T24 R-CDIP-T24
Logic IC Type ARITHMETIC LOGIC UNIT ARITHMETIC LOGIC UNIT
Number of Bits 2 2
Number of Functions 4 4
Number of Terminals 24 24
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 100 ns 100 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535 Class B
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 4 4
Rohs Code No
JESD-609 Code e0
Terminal Finish TIN LEAD

Compare M38510/30801BJX with alternatives

Compare M38510/30801BJA with alternatives