M38510/30605BCX vs GD74LS164 feature comparison

M38510/30605BCX Philips Semiconductors

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GD74LS164 LG Semicon Co Ltd

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIGNETICS CORP LG SEMICON CO LTD
Package Description DIP, DIP, DIP14,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Count Direction RIGHT RIGHT
Family LS LS
JESD-30 Code R-GDIP-T14 R-PDIP-T14
Logic IC Type SERIAL IN PARALLEL OUT SERIAL IN PARALLEL OUT
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 14 14
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 56 ns 32 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535 Class B
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
fmax-Min 20 MHz
Base Number Matches 11 2
Rohs Code No
JESD-609 Code e0
Max Frequency@Nom-Sup 25000000 Hz
Package Equivalence Code DIP14,.3
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm

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