M38510/30501BCX vs SN74LS32J feature comparison

M38510/30501BCX NXP Semiconductors

Buy Now

SN74LS32J Freescale Semiconductor

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code DIP
Package Description DIP, DIP, DIP14,.3
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family LS
JESD-30 Code R-GDIP-T14 R-XDIP-T14
Logic IC Type OR GATE OR GATE
Number of Functions 4
Number of Inputs 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 35 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535 Class B
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 10 5
Rohs Code No
JESD-609 Code e0
Max I(ol) 0.008 A
Package Equivalence Code DIP14,.3
Power Supplies 5 V
Power Supply Current-Max (ICC) 9.8 mA
Prop. Delay@Nom-Sup 22 ns
Schmitt Trigger NO
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm

Compare M38510/30501BCX with alternatives