M38510/30204BCX vs M38510/30204BCA feature comparison

M38510/30204BCX Rochester Electronics LLC

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M38510/30204BCA Freescale Semiconductor

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code DIP
Package Description DIP, DIP, DIP14,.3
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family LS
JESD-30 Code R-GDIP-T14 R-XDIP-T14
Logic IC Type NOR GATE NOR GATE
Number of Functions 4
Number of Inputs 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 30 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 4 5
Rohs Code No
JESD-609 Code e0
Max I(ol) 0.012 A
Package Equivalence Code DIP14,.3
Power Supplies 5 V
Power Supply Current-Max (ICC) 13.8 mA
Prop. Delay@Nom-Sup 30 ns
Schmitt Trigger NO
Screening Level 38535Q/M;38534H;883B
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm

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