M38510/30107BEX
vs
54LS175/BEA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MOTOROLA INC
PHILIPS SEMICONDUCTORS
Package Description
DIP,
DIP-16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LS
JESD-30 Code
R-GDIP-T16
R-XDIP-T16
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Bits
1
Number of Functions
4
4
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
COMPLEMENTARY
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
55 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
fmax-Min
25 MHz
Base Number Matches
8
3
Rohs Code
JESD-609 Code
e0
Max Frequency@Nom-Sup
30000000 Hz
Max I(ol)
0.004 A
Package Equivalence Code
DIP16,.3
Power Supply Current-Max (ICC)
18 mA
Screening Level
38535Q/M;38534H;883B
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Pitch
2.54 mm
Compare M38510/30107BEX with alternatives
Compare 54LS175/BEA with alternatives