M38510/30106BEX vs SN74LS259BDE4 feature comparison

M38510/30106BEX Lansdale Semiconductor Inc

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SN74LS259BDE4 Texas Instruments

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer LANSDALE SEMICONDUCTOR INC TEXAS INSTRUMENTS INC
Part Package Code DIP SOIC
Package Description DIP, SOP, SOP16,.25
Pin Count 16 16
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LS LS
JESD-30 Code R-GDIP-T16 R-PDSO-G16
Logic IC Type D FLIP-FLOP D LATCH
Number of Bits 1 1
Number of Functions 6 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Output Polarity COMPLEMENTARY TRUE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 52 ns 24 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology TTL TTL
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE LOW LEVEL
fmax-Min 25 MHz
Base Number Matches 1 1
Pbfree Code No
Rohs Code Yes
Additional Feature 1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH
JESD-609 Code e4
Length 9.9 mm
Load Capacitance (CL) 15 pF
Max I(ol) 0.008 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP16,.25
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 36 mA
Prop. Delay@Nom-Sup 30 ns
Seated Height-Max 1.75 mm
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm

Compare M38510/30106BEX with alternatives

Compare SN74LS259BDE4 with alternatives