M38510/30104BCX vs 74LS113F feature comparison

M38510/30104BCX Motorola Semiconductor Products

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74LS113F NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC SIGNETICS CORP
Package Description DIP, ,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LS LS
JESD-30 Code R-GDIP-T14 R-GDIP-T14
Logic IC Type J-K FLIP-FLOP J-K FLIP-FLOP
Number of Bits 2 2
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 42 ns 30 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535 Class B
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Trigger Type NEGATIVE EDGE NEGATIVE EDGE
fmax-Min 25 MHz 30 MHz
Base Number Matches 7 3
Load Capacitance (CL) 15 pF
Power Supply Current-Max (ICC) 8 mA

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