M38510/30104BBX vs HD74LS113P feature comparison

M38510/30104BBX Lansdale Semiconductor Inc

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HD74LS113P Renesas Electronics Corporation

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer LANSDALE SEMICONDUCTOR INC RENESAS ELECTRONICS CORP
Part Package Code DFP DIP
Package Description DFP, DIP, DIP14,.3
Pin Count 14 14
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LS LS
JESD-30 Code R-GDFP-F14 R-PDIP-T14
Logic IC Type J-K FLIP-FLOP J-K FLIP-FLOP
Number of Bits 2 2
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 75 °C
Operating Temperature-Min -55 °C -20 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DFP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK IN-LINE
Propagation Delay (tpd) 42 ns 30 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology TTL TTL
Temperature Grade MILITARY COMMERCIAL EXTENDED
Terminal Form FLAT THROUGH-HOLE
Terminal Position DUAL DUAL
Trigger Type NEGATIVE EDGE NEGATIVE EDGE
fmax-Min 25 MHz 30 MHz
Base Number Matches 3 2
Length 19.2 mm
Max Frequency@Nom-Sup 30000000 Hz
Max I(ol) 0.008 A
Package Equivalence Code DIP14,.3
Power Supply Current-Max (ICC) 8 mA
Seated Height-Max 5.06 mm
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare M38510/30104BBX with alternatives

Compare HD74LS113P with alternatives