M38510/30104BBX vs SN54LS113AJ feature comparison

M38510/30104BBX QP Semiconductor

Buy Now

SN54LS113AJ Motorola Mobility LLC

Buy Now Datasheet
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer QP SEMICONDUCTOR INC MOTOROLA INC
Part Package Code DFP DIP
Package Description DFP, DIP, DIP14,.3
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LS LS
JESD-30 Code R-GDFP-F14 R-GDIP-T14
Logic IC Type J-K FLIP-FLOP J-K FLIP-FLOP
Number of Bits 2 2
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DFP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK IN-LINE
Propagation Delay (tpd) 42 ns 20 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology TTL TTL
Temperature Grade MILITARY MILITARY
Terminal Form FLAT THROUGH-HOLE
Terminal Position DUAL DUAL
Trigger Type NEGATIVE EDGE NEGATIVE EDGE
fmax-Min 25 MHz 30 MHz
Base Number Matches 1 2
Rohs Code No
JESD-609 Code e0
Length 19.495 mm
Load Capacitance (CL) 15 pF
Max Frequency@Nom-Sup 30000000 Hz
Max I(ol) 0.004 A
Package Equivalence Code DIP14,.3
Power Supply Current-Max (ICC) 6 mA
Seated Height-Max 5.08 mm
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare M38510/30104BBX with alternatives

Compare SN54LS113AJ with alternatives