M38510/30104BBX
vs
HD74LS113FP
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
QP SEMICONDUCTOR INC
|
RENESAS TECHNOLOGY CORP
|
| Part Package Code |
DFP
|
SOIC
|
| Package Description |
DFP,
|
SOP,
|
| Pin Count |
14
|
14
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
LS
|
LS
|
| JESD-30 Code |
R-GDFP-F14
|
R-PDSO-G14
|
| Logic IC Type |
J-K FLIP-FLOP
|
J-K FLIP-FLOP
|
| Number of Bits |
2
|
2
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
125 °C
|
75 °C
|
| Operating Temperature-Min |
-55 °C
|
-20 °C
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DFP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
SMALL OUTLINE
|
| Propagation Delay (tpd) |
42 ns
|
30 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
MILITARY
|
COMMERCIAL EXTENDED
|
| Terminal Form |
FLAT
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Trigger Type |
NEGATIVE EDGE
|
NEGATIVE EDGE
|
| fmax-Min |
25 MHz
|
30 MHz
|
| Base Number Matches |
1
|
2
|
| Length |
|
10.06 mm
|
| Seated Height-Max |
|
2.2 mm
|
| Terminal Pitch |
|
1.27 mm
|
| Width |
|
5.5 mm
|
|
|
|
Compare M38510/30104BBX with alternatives
Compare HD74LS113FP with alternatives