M38510/30102SDA vs 74ABT74PW feature comparison

M38510/30102SDA NXP Semiconductors

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74ABT74PW NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code DFP TSSOP
Package Description CERAMIC, DFP-14 TSSOP, TSSOP14,.25
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LS ABT
JESD-30 Code R-GDFP-F14 R-PDSO-G14
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 1 1
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DFP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 59 ns 4 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535 Class S
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology TTL BICMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form FLAT GULL WING
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
fmax-Min 20 MHz 150 MHz
Base Number Matches 4 3
Rohs Code Yes
JESD-609 Code e4
Length 5 mm
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 150000000 Hz
Max I(ol) 0.02 A
Moisture Sensitivity Level 1
Package Equivalence Code TSSOP14,.25
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 0.05 mA
Prop. Delay@Nom-Sup 4.7 ns
Seated Height-Max 1.1 mm
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch 0.65 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 4.4 mm

Compare M38510/30102SDA with alternatives

Compare 74ABT74PW with alternatives