M38510/30102BAX vs HD74HC113FP-E feature comparison

M38510/30102BAX Lansdale Semiconductor Inc

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HD74HC113FP-E Renesas Electronics Corporation

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Rohs Code No Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer LANSDALE SEMICONDUCTOR INC RENESAS ELECTRONICS CORP
Part Package Code DFP SOIC
Package Description DFP, SOP,
Pin Count 14 14
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LS HC/UH
JESD-30 Code R-GDFP-F14 R-PDSO-G14
Logic IC Type D FLIP-FLOP J-K FLIP-FLOP
Number of Bits 1 2
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DFP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 59 ns 190 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES YES
Technology TTL CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form FLAT GULL WING
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Trigger Type POSITIVE EDGE NEGATIVE EDGE
fmax-Min 20 MHz
Base Number Matches 1 1
Pbfree Code Yes
JESD-609 Code e6
Length 10.06 mm
Moisture Sensitivity Level 1
Seated Height-Max 2.2 mm
Terminal Finish TIN BISMUTH
Terminal Pitch 1.27 mm
Width 5.5 mm

Compare M38510/30102BAX with alternatives

Compare HD74HC113FP-E with alternatives