M38510/30101BCX vs N74LV74PW feature comparison

M38510/30101BCX SRI International Sarnoff

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N74LV74PW NXP Semiconductors

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer SRI INTERNATIONAL NXP SEMICONDUCTORS
Part Package Code DIP
Package Description DIP, TSSOP,
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LS LV/LV-A/LVX/H
JESD-30 Code R-GDIP-T14 R-PDSO-G14
Logic IC Type J-K FLIP-FLOP D FLIP-FLOP
Number of Bits 2 1
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 42 ns 33 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 1 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount NO YES
Technology TTL CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Trigger Type NEGATIVE EDGE POSITIVE EDGE
fmax-Min 25 MHz 48 MHz
Base Number Matches 1 4
Length 5 mm
Load Capacitance (CL) 50 pF
Seated Height-Max 1.1 mm
Terminal Pitch 0.65 mm
Width 4.4 mm

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Compare N74LV74PW with alternatives