M38510/30009BDX
vs
M38510/30009BAX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
TELEDYNE E2V (UK) LTD
Part Package Code
DFP
DFP
Package Description
DFP,
DFP,
Pin Count
14
14
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
LS
LS
JESD-30 Code
R-GDFP-F14
R-GDFP-F14
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
1
1
Number of Inputs
8
8
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DFP
DFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
FLATPACK
Propagation Delay (tpd)
38 ns
38 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
TTL
TTL
Temperature Grade
MILITARY
MILITARY
Terminal Form
FLAT
FLAT
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
ECCN Code
EAR99
kg CO2e/kg
12.4
Average Weight (mg)
602.4
CO2e (mg)
7469.76
Category CO2 Kg
12.4
Compliance Temperature Grade
Military: -55C to +125C
Candidate List Date
2015-12-17
Conflict Mineral Status
DRC Conflict Free
Conflict Mineral Status Source
CMRT V6.01
Compare M38510/30009BDX with alternatives
Compare M38510/30009BAX with alternatives