M38510/30009BDX vs 54LS30LMQB feature comparison

M38510/30009BDX NXP Semiconductors

Buy Now

54LS30LMQB National Semiconductor Corporation

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NATIONAL SEMICONDUCTOR CORP
Part Package Code DFP
Package Description DFP, CERAMIC, LCC-20
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family LS LS
JESD-30 Code R-GDFP-F14 S-CQCC-N20
Logic IC Type NAND GATE NAND GATE
Number of Functions 1 1
Number of Inputs 8 8
Number of Terminals 14 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DFP QCCN
Package Shape RECTANGULAR SQUARE
Package Style FLATPACK CHIP CARRIER
Propagation Delay (tpd) 38 ns 20 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology TTL TTL
Temperature Grade MILITARY MILITARY
Terminal Form FLAT NO LEAD
Terminal Position DUAL QUAD
Base Number Matches 1 1
Length 8.89 mm
Load Capacitance (CL) 15 pF
Max I(ol) 0.004 A
Package Equivalence Code LCC20,.35SQ
Power Supply Current-Max (ICC) 1.1 mA
Prop. Delay@Nom-Sup 20 ns
Schmitt Trigger NO
Screening Level MIL-STD-883 Class B
Seated Height-Max 1.905 mm
Terminal Pitch 1.27 mm
Width 8.89 mm

Compare M38510/30009BDX with alternatives

Compare 54LS30LMQB with alternatives