M38510/30009BCC vs SN54LS30J feature comparison

M38510/30009BCC SRI International Sarnoff

Buy Now

SN54LS30J Freescale Semiconductor

Buy Now Datasheet
Part Life Cycle Code Active Obsolete
Ihs Manufacturer SRI INTERNATIONAL MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code DIP
Package Description DIP, DIP14,.3 DIP, DIP14,.3
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family LS
JESD-30 Code R-GDIP-T14 R-XDIP-T14
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 1
Number of Inputs 8
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supply Current-Max (ICC) 1.1 mA 1.1 mA
Prop. Delay@Nom-Sup 38 ns 20 ns
Propagation Delay (tpd) 38 ns
Qualification Status Qualified Not Qualified
Schmitt Trigger NO NO
Screening Level MIL-PRF-38535 Class B
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 1 6
Rohs Code No
JESD-609 Code e0
Power Supplies 5 V
Terminal Finish Tin/Lead (Sn/Pb)

Compare M38510/30009BCC with alternatives