M38510/30005SCX vs M38510/30005BCA feature comparison

M38510/30005SCX NXP Semiconductors

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M38510/30005BCA Texas Instruments

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Part Package Code DIP DIP
Package Description DIP, DIP, DIP14,.3
Pin Count 14 14
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LS LS
JESD-30 Code R-GDIP-T14 R-GDIP-T14
Logic IC Type NAND GATE NAND GATE
Number of Functions 3 3
Number of Inputs 3 3
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 24 ns 24 ns
Qualification Status Not Qualified Qualified
Screening Level MIL-PRF-38535 Class S MIL-PRF-38535 Class B
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 3 11
Pbfree Code Yes
Rohs Code No
JESD-609 Code e0
Length 19.56 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.001 A
Package Equivalence Code DIP14,.3
Packing Method TUBE
Power Supply Current-Max (ICC) 3.3 mA
Prop. Delay@Nom-Sup 24 ns
Schmitt Trigger NO
Seated Height-Max 5.08 mm
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 6.67 mm

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Compare M38510/30005BCA with alternatives