M38510/30001BCX vs GD74LS26 feature comparison

M38510/30001BCX National Semiconductor Corporation

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GD74LS26 LG Semicon Co Ltd

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP LG SEMICON CO LTD
Package Description DIP, DIP, DIP14,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LS
JESD-30 Code R-GDIP-T14 R-PDIP-T14
Logic IC Type NAND GATE NAND GATE
Number of Functions 4
Number of Inputs 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 24 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 11 2
Rohs Code No
JESD-609 Code e0
Max I(ol) 0.008 A
Output Characteristics OPEN-COLLECTOR
Package Equivalence Code DIP14,.3
Power Supply Current-Max (ICC) 4.4 mA
Prop. Delay@Nom-Sup 32 ns
Schmitt Trigger NO
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm

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