M38510/26003BYX vs 5962-8683004YX feature comparison

M38510/26003BYX LSI Corporation

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5962-8683004YX LSI Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SEEQ TECHNOLOGY INC SEEQ TECHNOLOGY INC
Part Package Code QFJ QFJ
Package Description QCCN, QCCN,
Pin Count 32 32
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.51 8542.32.00.51
Category CO2 Kg 12 12
Compliance Temperature Grade Military: -55C to +125C Military: -55C to +125C
Access Time-Max 250 ns 250 ns
JESD-30 Code R-XQCC-N32 R-XQCC-N32
Memory Density 65536 bit 65536 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 8KX8 8KX8
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code QCCN QCCN
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS NMOS
Temperature Grade MILITARY MILITARY
Terminal Form NO LEAD NO LEAD
Terminal Position QUAD QUAD
Write Cycle Time-Max (tWC) 10 ms 1 ms
Base Number Matches 3 1
Screening Level MIL-STD-883

Compare M38510/26003BYX with alternatives

Compare 5962-8683004YX with alternatives