M38510/20702BFX vs 82S123B/BFA feature comparison

M38510/20702BFX Lansdale Semiconductor Inc

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82S123B/BFA YAGEO Corporation

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer LANSDALE SEMICONDUCTOR INC PHILIPS COMPONENTS
Part Package Code DFP
Package Description DFP, ,
Pin Count 16
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 25 ns 30 ns
JESD-30 Code R-XDFP-F16 R-CDFP-F16
Memory Density 16384 bit 256 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 16 16
Number of Words 32 words 32 words
Number of Words Code 2000 32
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 2KX8 32X8
Package Body Material UNSPECIFIED CERAMIC, METAL-SEALED COFIRED
Package Code DFP
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK FLATPACK
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY MILITARY
Terminal Form FLAT FLAT
Terminal Position DUAL DUAL
Base Number Matches 1 1
Output Characteristics 3-STATE

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