M38510/20702BEX vs 5962-8670301EX feature comparison

M38510/20702BEX National Semiconductor Corporation

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5962-8670301EX YAGEO Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP PHILIPS COMPONENTS
Package Description DIP, DIP,
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
JESD-30 Code R-XDIP-T16 R-GDIP-T16
Memory Density 4096 bit 256 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 4 8
Number of Functions 1 1
Number of Terminals 16 16
Number of Words 32 words 32 words
Number of Words Code 1000 32
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 1KX4 32X8
Package Body Material UNSPECIFIED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-M-38510 Class B MIL-STD-883
Supply Current-Max 0.13 mA 0.115 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 10 6
Part Package Code DIP
Pin Count 16
Access Time-Max 50 ns
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V

Compare M38510/20702BEX with alternatives

Compare 5962-8670301EX with alternatives