M38510/20302SEX vs M38510/20302BEA feature comparison

M38510/20302SEX NXP Semiconductors

Buy Now

M38510/20302BEA QP Semiconductor

Buy Now
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS QP SEMICONDUCTOR INC
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 16 16
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 45 ns 75 ns
JESD-30 Code R-XDIP-T16 R-XDIP-T16
JESD-609 Code e3/e4 e0
Memory Density 4096 bit 1024 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 4
Number of Functions 1 1
Number of Terminals 16 16
Number of Words 256 words 256 words
Number of Words Code 512 256
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 512X8 256X4
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Current-Max 0.155 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY MILITARY
Terminal Finish TIN/NICKEL PALLADIUM GOLD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 6
Screening Level MIL-M-38510 Class B
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V

Compare M38510/20302SEX with alternatives

Compare M38510/20302BEA with alternatives