M38510/20302BEA vs AM27S20A/BEA feature comparison

M38510/20302BEA NXP Semiconductors

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AM27S20A/BEA AMD

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS ADVANCED MICRO DEVICES INC
Part Package Code DIP DIP
Package Description DIP, DIP, DIP16,.3
Pin Count 16 16
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 120 ns 40 ns
JESD-30 Code R-XDIP-T16 R-CDIP-T16
Memory Density 4194304 bit 1024 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 16 4
Number of Functions 1 1
Number of Terminals 16 16
Number of Words 256 words 256 words
Number of Words Code 256000 256
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 256KX16 256X4
Package Body Material UNSPECIFIED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-M-38510 Class B 38535Q/M;38534H;883B
Supply Current-Max 0.03 mA 0.13 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 6 1
Pbfree Code No
Rohs Code No
JESD-609 Code e0
Length 19.431 mm
Output Characteristics OPEN-COLLECTOR
Package Equivalence Code DIP16,.3
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare M38510/20302BEA with alternatives

Compare AM27S20A/BEA with alternatives