M38510/20302BEA
vs
AM27S20A/BEA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
ADVANCED MICRO DEVICES INC
Part Package Code
DIP
DIP
Package Description
DIP,
DIP, DIP16,.3
Pin Count
16
16
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
120 ns
40 ns
JESD-30 Code
R-XDIP-T16
R-CDIP-T16
Memory Density
4194304 bit
1024 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
16
4
Number of Functions
1
1
Number of Terminals
16
16
Number of Words
256 words
256 words
Number of Words Code
256000
256
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
256KX16
256X4
Package Body Material
UNSPECIFIED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-M-38510 Class B
38535Q/M;38534H;883B
Supply Current-Max
0.03 mA
0.13 mA
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
6
1
Pbfree Code
No
Rohs Code
No
JESD-609 Code
e0
Length
19.431 mm
Output Characteristics
OPEN-COLLECTOR
Package Equivalence Code
DIP16,.3
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare M38510/20302BEA with alternatives
Compare AM27S20A/BEA with alternatives