M38510/17204BCX vs HCF4077BEY feature comparison

M38510/17204BCX NXP Semiconductors

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HCF4077BEY STMicroelectronics

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS STMICROELECTRONICS
Part Package Code DIP DIP
Package Description DIP, PLASTIC, DIP-14
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T14 R-PDIP-T14
Logic IC Type XNOR GATE XNOR GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 350 ns 280 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 15 V 20 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 4 1
Pbfree Code Yes
Rohs Code Yes
Samacsys Manufacturer STMicroelectronics
JESD-609 Code e3
Load Capacitance (CL) 50 pF
Max I(ol) 0.00035999999999999997 A
Package Equivalence Code DIP14,.3
Packing Method TUBE
Prop. Delay@Nom-Sup 280 ns
Schmitt Trigger NO
Seated Height-Max 5.1 mm
Terminal Finish MATTE TIN
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare M38510/17204BCX with alternatives

Compare HCF4077BEY with alternatives