M38510/11601BCC
vs
DG300ABK
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
HARRIS SEMICONDUCTOR
ROCHESTER ELECTRONICS LLC
Part Package Code
DIP
DIP
Package Description
DIP,
DIP,
Pin Count
14
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
SPST
SPST
JESD-30 Code
R-CDIP-T14
R-GDIP-T14
Neg Supply Voltage-Nom (Vsup)
-15 V
-15 V
Number of Channels
2
1
Number of Functions
2
2
Number of Terminals
14
14
On-state Resistance-Max (Ron)
75 Ω
50 Ω
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-25 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Screening Level
MIL-PRF-38535 Class B
Supply Voltage-Nom (Vsup)
15 V
15 V
Surface Mount
NO
NO
Switch-off Time-Max
250 ns
Switch-on Time-Max
300 ns
Technology
CMOS
CMOS
Temperature Grade
MILITARY
OTHER
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
2
7
Pbfree Code
Rohs Code
JESD-609 Code
e0
Length
9.585 mm
Off-state Isolation-Nom
62 dB
Package Equivalence Code
DIP14,.3
Seated Height-Max
5.33 mm
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare M38510/11601BCC with alternatives