M38510/11106BCX
vs
DG387AAK/883
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
HARRIS SEMICONDUCTOR
MAXIM INTEGRATED PRODUCTS INC
Part Package Code
DIP
Package Description
DIP,
Pin Count
14
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
SPDT
SPDT
JESD-30 Code
R-XDIP-T14
R-XDIP-T14
Neg Supply Voltage-Nom (Vsup)
-15 V
-15 V
Number of Channels
1
Number of Functions
1
1
Number of Terminals
14
14
Off-state Isolation-Nom
50 dB
On-state Resistance-Max (Ron)
150 Ω
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
UNSPECIFIED
CERAMIC
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-M-38510 Class B
38535Q/M;38534H;883B
Supply Voltage-Nom (Vsup)
15 V
15 V
Surface Mount
NO
NO
Switch-off Time-Max
130 ns
Switch-on Time-Max
250 ns
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
2
3
Rohs Code
JESD-609 Code
e0
Package Equivalence Code
DIP14,.3
Switching
BREAK-BEFORE-MAKE
Technology
CMOS
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Compare M38510/11106BCX with alternatives