M38510/10901BPA vs 5962-8950301PA feature comparison

M38510/10901BPA NXP Semiconductors

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5962-8950301PA Texas Instruments

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Package Description DIP, DIP, DIP8,.3
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type PULSE; RECTANGULAR PULSE; RECTANGULAR
JESD-30 Code R-GDIP-T8 R-GDIP-T8
Length 9.6 mm 9.6 mm
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP8,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT APPLICABLE
Qualification Status Not Qualified Qualified
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max (Vsup) 18 V 15 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT APPLICABLE
Width 7.62 mm 7.62 mm
Base Number Matches 3 1
Rohs Code No
Part Package Code DIP
Pin Count 8
Additional Feature IT CAN ALSO OPERATE AT 15 V NOMINAL SUPPLY
JESD-609 Code e0
Output Frequency-Max 1.2 MHz
Screening Level MIL-STD-883
Supply Current-Max (Isup) 0.7 mA
Technology CMOS
Terminal Finish TIN LEAD

Compare M38510/10901BPA with alternatives

Compare 5962-8950301PA with alternatives