M38510/10107BPA
vs
LM118J8
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROSS COMPONENTS
HARRIS SEMICONDUCTOR
Package Description
DIP, DIP8,.3
DIP, DIP8,.3
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Factory Lead Time
26 Weeks
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.4 µA
Bias Current-Max (IIB) @25C
0.25 µA
Common-mode Reject Ratio-Min
80 dB
Frequency Compensation
YES
YES
Input Offset Voltage-Max
6000 µV
6000 µV
JESD-30 Code
R-CDIP-T8
R-XDIP-T8
JESD-609 Code
e0
e0
Low-Offset
NO
NO
Micropower
NO
Neg Supply Voltage Limit-Max
-22 V
Neg Supply Voltage-Nom (Vsup)
-15 V
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC
Package Code
DIP
DIP
Package Equivalence Code
DIP8,.3
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535 Class B
Slew Rate-Min
40 V/us
Supply Current-Max
8 mA
Supply Voltage Limit-Max
22 V
Supply Voltage-Nom (Vsup)
15 V
Surface Mount
NO
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
MILITARY
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Voltage Gain-Min
50000
Base Number Matches
6
3
Rohs Code
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